Hello, everyone,

A problem happened when I did my electroplating gold: Before I do the
electroplating, I sputtered a layer of TiW800A/Au2000A for seed layer. And
the I used the thick PR to be the module for plating gold. After finished
the plating, I removed the PR, and want to remove the seed layer also. The
problem happened when I used KI+I2+H2O to etch the seed layer: Gold. I can
never etch them away clearly. How does it happen? Is it possible that
sputtering gold can't be etch by KI+I2+H2O afer being covered by PR or
being dip in the solution for electroplating?

Thank you for your attension.

Best regards,

Vickie