Conventional "flex" circuit processes might be adequate for your metal/
polyimide patterning needs. Look at your HP inkjet printer cartridges, for
example.

For more advanced applications, there is some nice work going on at NASA
Langley Research Center under the acronym LARC-SI (Soluble Imide). LARC-SI is a
high performance thermoplastic which is particularly versatile with respect to
bonding to other materials. Brantley Hanks ([email protected]) will
forward you to the relevant individuals.

Mike Hecht
Jet Propulsion Lab
______________________________ Reply Separator _________________________________
Subject: Re: processing information wanted
Author: [email protected] at hugate
Date:    6/10/96 11:17 AM


    Message From: [email protected] at hugate

>We have two problems we are seeking some help with:
>
>1. We want to deposit a patterned metal film onto polyimide. Any
>suggestion regarding suitable metals that give at lweast some modest
>adhesion?
>
>2.  We are also looking for a source of SiC films or diamond-like C
>fdilms or any other refractory carbide or nitride (WC, BN, etc).
>
Answer to 1.: the general use in MCM is Cr addesion layer plus Cu
conducting one; both deposited preferably by sputtering. If you want to
make a multilayer system, you must coat the copper with another Cr layer
for addhesion of the next polyimide coating. The copper layer can be
thickened by electroplating.
Good luck!
Pierre.
__________________________________________________________________
Swiss Federal Institute of Technology (EPFL)
Address:  EPFL, CH-1015 Lausanne, Switzerland
Pierre Jaccard
Phone: +41(21)693 66 38
FAX:    + 41(21)693 66 70
__________________________________________________________________