I have a new design that I would like your collective opinion on. First off
how much of the MEMS work that is currently being done or will in the near
future require etching of quartz pyrex or soda lime glass? Can anyone
determine the range of etch depth requirements? I understand from talking
with some MEMS engineers that 3 microns depth on pyrex or glass substrates is
required. Also, does the profile of the etch need to be anisotropic is would
a 60-70 degree slope be preferable for step coverage? If a slope is required
would a wet etch with a 2% uniformity across the wafer be acceptable? My
proposed design would provide the above results in a single wafer etch
design. Since we build production equipment our ultimate design would do
multiple wafers at a time for increased throughput. Does this process merit
serious consideration and would anyone be interested in pursuing this process
with us? Let me know

Bob Henderson
Process Integration,LLC
75 W. Baseline Rd. Suite E-32
Gilbert, Arizona 85233
Phone: 480-558-1156
Fax: 480-558-1161
email: [email protected]