A MEMS Clearinghouse® and information portal
for the MEMS and Nanotechnology community
RegisterSign-In
MEMSnet Home About Us What is MEMS? Beginner's Guide Discussion Groups Advertise Here
News
MEMSnet Home: MEMS-Talk: wire bonding
wire bonding
2001-11-19
Haigh, Richard Daniel
2001-12-10
Sun Yu
2001-12-10
Michael Young
2001-12-11
Danny Klein
2001-12-11
Chua Bee Lee
wire bonding
Michael Young
2001-12-10
Sun,

You can try thermo-compression or conductive epoxy.

Michael
ACSI

-----Original Message-----
From: [email protected] [mailto:[email protected]]On
Behalf Of Sun Yu
Sent: Monday, December 10, 2001 2:16 PM
To: [email protected]
Subject: [mems-talk] wire bonding


Hi, friends, I am writing to seek help in wire bonding. My released
devices have perfect electical contacts (Al, 5000 Angstroms); but because
of weak mechanical adhesion to the underneath Si, when wire bonding was
performed, the Al contacts were peeled off (broken), which led to failure
in wire bonding. I am wondering if it is remotely possible that there are
some other means to bond my contacts, such as a different way of wire
bonding (not using ultrosonic) or whatever other approaches to save these
perfect devices (except this wire bonding problem). I sincerely appreciate
your help. Thanks.

Best,

Sun
_______________________________________________
[email protected] mailing list: to unsubscribe or change your list
options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk
Hosted by the MEMS Exchange, providers of MEMS processing services.
Visit us at http://www.mems-exchange.org/

reply
Events
Glossary
Materials
Links
MEMS-talk
Terms of Use | Contact Us | Search
MEMS Exchange
MEMS Industry Group
Coventor
Harrick Plasma
Tanner EDA
University Wafer
Process Variations in Microsystems Manufacturing
Mentor Graphics Corporation
Tanner EDA by Mentor Graphics