Hi,
Try using the pads as the B-bond. Start with the contacts on your cerdip etc
package and terminate the wire on your device. If your wirebonder is fully
manual, it can be done if you are careful.

Good luck.
Beelee.

-----Original Message-----
From: Sun Yu
To: [email protected]
Sent: 12/11/01 6:15 AM
Subject: [mems-talk] wire bonding

Hi, friends, I am writing to seek help in wire bonding. My released
devices have perfect electical contacts (Al, 5000 Angstroms); but
because
of weak mechanical adhesion to the underneath Si, when wire bonding was
performed, the Al contacts were peeled off (broken), which led to
failure
in wire bonding. I am wondering if it is remotely possible that there
are
some other means to bond my contacts, such as a different way of wire
bonding (not using ultrosonic) or whatever other approaches to save
these
perfect devices (except this wire bonding problem). I sincerely
appreciate
your help. Thanks.

Best,

Sun
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