Hello Sun Yu,

    If your device enables it, I can offer a non necessarily MEMS solution.You
could add a bridge with two leaf springs, that on one end would make the
contacts with the device, and than you could solder the electric contacts to
the other end (the base) of the springs.
    Another choice could be again another bridge, on which you could mount two
spring pins that would make the contact with the device on one end, and on the
other end solder the electric contacts.

I hope these ideas helped you. Good Luck

Danny Klein.
-----------------------------------------------------

Danny Klein
Faculty of Mechanical Engineering
Technion, Israel Institute of Technology
Haifa, 32000
Israel

Tel: 972-4-8292946
Email: [email protected]

----------------------------------------------------


  ----- Original Message -----
  From: Sun Yu
  To: [email protected]
  Sent: Tuesday, December 11, 2001 12:15 AM
  Subject: [mems-talk] wire bonding


  Hi, friends, I am writing to seek help in wire bonding. My released
  devices have perfect electical contacts (Al, 5000 Angstroms); but because
  of weak mechanical adhesion to the underneath Si, when wire bonding was
  performed, the Al contacts were peeled off (broken), which led to failure
  in wire bonding. I am wondering if it is remotely possible that there are
  some other means to bond my contacts, such as a different way of wire
  bonding (not using ultrosonic) or whatever other approaches to save these
  perfect devices (except this wire bonding problem). I sincerely appreciate
  your help. Thanks.

  Best,

  Sun
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