Hello,

I deposited SiN on fully cured polyimid (@350C) using PECVD at 250.
Polyimid will be removed to release nitride membrane. However,
I found the cracking of the nitride film. Our PECVD nitride film has
fairly low tensile stress ~150Mpa. So, is the cracking due to the CTE
mismatch between SiN and polyimid?  Has anyone done similar experiments?

Thanks
____________________________________________________________________
Kyu-Tae Yoo
Ph.D. candidate

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