Hi Mike:
That's what we are currently doing, but the films
still delaminate after structuring. Do you have an
idea how do manipulate the process parameters: gas
flows, vacuum, power, bias etc. to release the tensile
stress?
Thanks for your input.

Thomas



--- Michael Pedersen 
schrieb: > Hi Thomas,
> Perhaps you can deposit the layer in several steps
> of 2-3um per dep with
> annealing steps in between. This can reduce the
> overall stress due to
> densification of the film.
>
> -Mike Pedersen
>
> Jon Doe wrote:
>
> >  Hi all:
> > We are trying to deposit 4 to 10 um thick PSG with
> 7
> > to 14 wt% P in a Lam PECVD system. We are
> experiencing
> > very high stress and the film cracks and peels of
> > after an anneal.
> > Has anybody experience with such thick doped glass
> > films. If so, How did you overcome the stress?
> >
> > Thanks for your input.
> >
> > Thomas
> _______________________________________________
> [email protected] mailing list: to unsubscribe
> or change your list
> options, visit
>
http://mail.mems-exchange.org/mailman/listinfo/mems-talk
> Hosted by the MEMS Exchange, providers of MEMS
> processing services.
> Visit us at http://www.mems-exchange.org/

__________________________________________________________________

Gesendet von Yahoo! Mail - http://mail.yahoo.de
Ihre E-Mail noch individueller? - http://domains.yahoo.de