We have developed a 3-D etch simulation that works with any etchant (isotropic
or anisoptropic). We can simulate etching from masks provided in CIF or GDSII
or several other formats. Details can be found at:

    http://red.caltech.edu/Research/MEMS/uMachine.html

We are open to running a few test simulations for interested parties, and also
open to distributing our simulator (available to run on SUN/Solaris computers)
for evaluation purposes to qualified parties.

-erik
Erik K. Antonsson, Ph.D., P.E.  Associate Professor of Mechanical Engineering
Engineering Design Research Laboratory        e-mail: [email protected]
California Institute of Technology (Caltech)             Voice:  818/395-3790
1200 East California Blvd., Mail Code: 104-44              FAX:  818/583-4963
Pasadena, CA  91125, U.S.A.             WWW HomePage: http://red.caltech.edu/

> From [email protected] Tue Jun 18 08:27:03 1996
> Subject: SIMULATION TOOLS FOR ANISOTROPIC WET SILICON ETCHING
> To: [email protected]
> X-Url: http://mems.isi.edu/mems.html
> Reply-To: [email protected]
>
> Dear members,
>
> We are interested in acquiring a software tool for simulating anisotropic
> wet silicon etching. We are therefore looking for any information you
> could have concerning existing softwares and their advantages and drawbacks.
>
> Does anyone for example have any experience with the simulation tool SIMODE?
>
> Yours sincerely,
>
> Christine ALEPEE
>
>  _________________________________________________
> |                                                 |
> |  Christine ALEPEE                               |
> |  Microsystems Institute - IN                    |
> |  Swiss Federal Institute of Technology          |
> |  CH - 1015 Lausanne                             |
> |                                                 |
> |  Phone:        +41 21 693 66 98                 |
> |  Fax:              +41 21 693 66 70             |
> |  Email: [email protected]     |
> |_________________________________________________|
>