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Temperature up to 120 deg. Celsius
Holes diameter: 300 micrometer and tolerance 50 micrometer.
Heike Bartsch de Torres

Heike Bartsch de Torres schrieb:

> Helo Roger,
> if your structure withstand temperatures up to 1200C you can structure it by
> sandblasting. 3005m-holes can be done with a tolerance of about 505m.
> Another possibility is to use an deep ICP-Process (Bosch).
> Greetings Heike
>
> Heike Bartsch de Torres
> Dev. Eng.
> Little Things Factory GmbH
> Ehrenbergstr. 11
> 98693 Ilmenau
> Germany
> [email protected]
>
> Roger Brennan schrieb:
>
> > Greetings:
> > Is the following feasible?
> > 1) Mask <100> silicon wafers having aluminum and titanium structures.
> > 2) Etch holes all the way through (300 microns) etching from both sides
> > using EDP or KOH.
> > 3) Remove the photoresist without disturbing the Ti or Al.  (I worry about
> > galvanic effects during the stripping due to the presence of Si, Ti, and
> > Al.)
> > It is my understanding that well cured SU8 might work as the resist and
> > SMST-M might work as the stripper.  The following is all I know about the
> > stripper:
> > "SMST-M This formulation is the standard formulation. It doesn't attact
> > metals such as aluminium, gold, titanium, chromium, but a slight attact of
> > copper and nickel can be observed."
> >
> > I have contacted the vendor of the stripper, SOTEC MICROSYSTEMS SA, but
> > often users know more than the vendor.
> >
> > Roger Brennan
> > Home:
> > 1403 Forrestal Avenue
> > San Jose, CA 95110
> > (408)453-0711 (telephone)
> > (408)573-9407 (fax)
> > [email protected]
> >
> > Work:
> > Endevco
> > 355 N. Pastoria Ave.
> > Sunnyvale, CA 94085
> > 408-739-3533 ext 204
> > [email protected]
> > _______________________________________________
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