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MEMSnet Home: MEMS-Talk: Hard mask for 20 um deep SiO2 RIE etch?
Hard mask for 20 um deep SiO2 RIE etch?
2001-12-19
[email protected]
2001-12-20
Liz Shelley
2001-12-20
Jon Doe
2001-12-20
[email protected]
2001-12-20
[email protected]
2001-12-20
BERAUER,FRANK (HP-Singapore,ex7)
Hard mask for 20 um deep SiO2 RIE etch?
Jon Doe
2001-12-20
 Hi Bob:
I am sorry that my question was ambiguous, but I am
looking for a hard mask to etch deep into oxide.

Thanks.

Thomas


--- [email protected] schrieb: > We have good results
with oxide as a hard mask.
> Typical selectivities are
> >60:1 using oxide. Better than that we have had
> great results using SU-8 from
> Microchem corp. Initial results show a 40:1
> selectivity pr:silicon and SU-8
> formulations can range from 5-100 microns. It also
> seems to ash or strip
> reasonably well at around 3 microns/minute. Bob
> Henderson
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