Try Aremco Crystalbond 509 (www.aremco.com ) - this is some plastic
with low melting temperature (130C), can be easily removed by acetone or by
hot photoresist remover (we use Shippley 1165 for debonding and cleanning at
the same time). We had no problems with either acids or bases treatment of
bonded substrates.
        see http://www.aremco.com/a9.html for process details
        Mike

> -----Original Message-----
> From: kaustubh bhate [SMTP:[email protected]]
> Sent: Friday, December 21, 2001 12:24 PM
> To:   [email protected]
> Subject:      [mems-talk] adhesives
>
> Hi Everybody,
> I am trying to bond some pre-thinned wafers (200um
> thick) with LPCVD nitride on it (1000A) - to a normal
> wafer substrate(500um ) thick.I need a temporary
> bonding adhesive which I should be able to remove
> after I have done some etching/lithography steps on
> the pre-thinned wafers.
>
> Does anybody know of commercially available adhesives
> that I can use for this? I need an adhesive which is
> very  simple in it's application and ideally would
> like something which I can just apply in-between the
> two wafers and then stick them together and later
> should be able to de-bond them easily too.
>
> Kaustubh Bhate.
>
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