Hi!
The answer is simple : Ultrasil is doing curently this kind of job for
different customers in optical switching device. We cut down by laser to
101.2 mm and we edge grind round to 100.02 mm with semistandard flat of 32.5
mm on plan <1-1-0>
All process is done by protecting front side with Mitsui tape. We also
dicharge all static electricity in any steps of operations. Removal of the
tape is done in class 10 clean room dipping the wafers in hot DIW ai 60 degre
C
If you need more info. please contact us.
Thanks


John Dancovich
3527 Breakwater Ave
Hayward CA 94545
Ph: 510-266-3700
Fx; 510-266-3720
e-mail: [email protected]