I understand that the same fusion bonding that is done with SOI wafer
using oxide can be done with a nitride layer. Suggest contact
http://www.affixtek.com as I know they were working on this.


Regards,
Ken

Nickolay V. Lavrik wrote:

> I know that standard bonding processes are
> available for materials such as Si, oxide and
> pyrex.
>
> Does any one if similar procedures exist for
> reliable (without organic adhesives) permanent
> bonding of Si and nitride coated wafers.
>
>
> Any relevant information will be highly
> appreciated
>
> Nickolay
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