Hi MEMS-people,

I have to questions:

(1) Has anyone information about outgasing of different glass wafers
(pyrex, quartz)? Do you know about quantitative measurements or
estimations of it? Do you know, how to avoid it efficiently? (like
baking the wafers prior to use, ho much does it reduce the
outgasing?) Is the outgasing much higher compared to "standard"
Si-wafers? I also would appreciate contacts with manufacturer of
glass wafers regarding this topic.

(2) I'm looking for measurements of residual stress in thin surface
micromachines layers due to processing (e.g. PECVD of SiO2,
sputtering/evaporation of metal layers...). I know that the stress
depends on a lot of parameters (machine, processing temperature,
thickness of the layer, previously processed layers, ... weather
conditions, coffee quality :-). The information from standard sources
like books, MEMS-related homepages, is not sufficient at all. I'm
very grateful for any information or hint.

Thanks for your help & good luck,

Joachim Oberhammer.
--
-----------------------------------------------------------------------------
-
Joachim Oberhammer, Dipl.-Ing.

Royal Institute of Technology (KTH)   Phone:    +46/(0)8 790 6250
Dep. of Signals, Sensors and Systems  Fax:      +46/(0)8 10 0858
Microsystem Technology (MST)          Mobile:   +46/(0)70 692 1858
                                       e-mail:   [email protected]
Osquldas vdg 10                       homepage: http://www.s3.kth.se/mst/
SE-100 44 Stockholm, Sweden