Dear MEMS colleagues,

1) I am trying to get Au patterns adhere to either silicon
oxide or nitride or even silicon without any barriers /
adhesion layers. Any good tricks or solutions? Is lift-off
viable?

2) Any non-commercial software for me to download to
perform dry etching evaluation with different process
parameters? And can the software adopt a RIE, ICP, or ECR
mode form of etching?

Please kindly advise. Many thanks in advance.

Best,
Randall, Ph.D
Singapore,DLS