A MEMS Clearinghouse® and information portal
for the MEMS and Nanotechnology community
RegisterSign-In
MEMSnet Home About Us What is MEMS? Beginner's Guide Discussion Groups Advertise Here
News
MEMSnet Home: MEMS-Talk: Clarification on the Burn Box Question
Clarification on the Burn Box Question
2002-02-01
Michael Martin
2002-02-04
Walter Stonas
2002-02-04
Roger Shile
2002-02-06
Michael D Martin
Clarification on the Burn Box Question
Walter Stonas
2002-02-04
Hi Mike,

What cleaning gases are you using for your chamber clean. Certain cleaning
gases are incompatible with process gases. If your cleaning gases contain
chlorine or fluorine molecules, many places require a wet scrubber and burn
box combination. In addition how many chamber do you want connect to the
system? If you want to connect several chamber to the same system, you need to
make sure you have seperate entrance ports to the system as well as nitrogen
purge curtain at the entrance port.

Sincerely,
Walter Stonas
Process Development Engineer

-----Original Message-----
From: Michael Martin [mailto:[email protected]]
Sent: Friday, February 01, 2002 9:18 AM
To: [email protected]
Subject: [mems-talk] Clarification on the Burn Box Question


Hi,
  We intend to PECVD deposit SiO2, Silicon Nitride and amorphous silicon
so we will likely be using SiH4, N2O, and NH3. Can anyone tell me what
sort of burn box we will require?

Thanks,
   Mike
_______________________________________________
[email protected] mailing list: to unsubscribe or change your list
options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk
Hosted by the MEMS Exchange, providers of MEMS processing services.
Visit us at http://www.mems-exchange.org/

reply
Events
Glossary
Materials
Links
MEMS-talk
Terms of Use | Contact Us | Search
MEMS Exchange
MEMS Industry Group
Coventor
Harrick Plasma
Tanner EDA
Nano-Master, Inc.
University Wafer
Mentor Graphics Corporation
Addison Engineering