Hi Randall,
   I can help you out with 1, in order to get gold to stick without an
adhesion layer you need to do energetic ion deposition. There are
serveral companies that can help you out, one that comes to mind is
Skion Corp. in NJ. www.skion.com .

-Mike

>>> [email protected] 02/03/02 10:56PM >>>
Dear MEMS colleagues,

1) I am trying to get Au patterns adhere to either silicon
oxide or nitride or even silicon without any barriers /
adhesion layers. Any good tricks or solutions? Is lift-off
viable?

2) Any non-commercial software for me to download to
perform dry etching evaluation with different process
parameters? And can the software adopt a RIE, ICP, or ECR
mode form of etching?

Please kindly advise. Many thanks in advance.

Best,
Randall, Ph.D
Singapore,DLS
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