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MEMSnet Home: MEMS-Talk: Clarification on the Burn Box Question
Clarification on the Burn Box Question
2002-02-01
Michael Martin
2002-02-04
Walter Stonas
2002-02-04
Roger Shile
2002-02-06
Michael D Martin
Clarification on the Burn Box Question
Michael D Martin
2002-02-06
Cleaning gases? Do you always have to use cleaning gases? Is this just
to remove particulates? I suppose we would use a flourine chemistry and
we have only one processing chamber that is contained by a glove box.

Thanks,
    Mike

>>> [email protected] 02/04/02 09:15AM >>>
Hi Mike,

What cleaning gases are you using for your chamber clean. Certain
cleaning
gases are incompatible with process gases. If your cleaning gases
contain
chlorine or fluorine molecules, many places require a wet scrubber and
burn
box combination. In addition how many chamber do you want connect to
the
system? If you want to connect several chamber to the same system, you
need to
make sure you have seperate entrance ports to the system as well as
nitrogen
purge curtain at the entrance port.

Sincerely,
Walter Stonas
Process Development Engineer

-----Original Message-----
From: Michael Martin [mailto:[email protected]]
Sent: Friday, February 01, 2002 9:18 AM
To: [email protected]
Subject: [mems-talk] Clarification on the Burn Box Question


Hi,
  We intend to PECVD deposit SiO2, Silicon Nitride and amorphous
silicon
so we will likely be using SiH4, N2O, and NH3. Can anyone tell me what
sort of burn box we will require?

Thanks,
   Mike
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