All three are options!
-Mike
>>> [email protected] 02/23/02 05:05AM >>>
Hi everybody!
I'm now wet etching to make through holes in 12 mil (305 microns) <100>
Si.
The desired hole size is about 10 mils by 30 mils (254 microns by 762
microns).
Is laser or physical drilling a possible alternative?
How about deep RIE?
Thanks.
Roger Brennan
Home:
1403 Forrestal Avenue
San Jose, CA 95110
(408)453-0711 (telephone)
(408)573-9407 (fax)
[email protected]
Work:
Endevco
355 N. Pastoria Ave.
Sunnyvale, CA 94085
408-739-3533 ext 204
[email protected]
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