Hi,

  You may want to have a look at the followings:
1. Tong, Q. and Gosele, U., Semiconductor Wafer Bonding
   Science and Technology, John Wiley, 1999.
2. Schmidt, M. A., "Wafer to Wafer Bonding for
   Microstructure Formation," Proceedings of IEEE, Vol. 86,
   no. 8, pp. 1575-1585, 1998.
  Regards,
  Ali :)
********************************************************************
 Ali Razavi
 Postdoctoral Fellow
 Room 455, Manufacturing Research Center
 Gerogia Institute of Technology, Atlanta, GA 30332-0405
 Phone: 678-637-1634, Fax: 404-894-9342
 E-mail: [email protected]
********************************************************************

-----Original Message-----
From: BERAUER,FRANK (HP-Singapore,ex7)
To: '[email protected]'
Sent: 3/7/02 4:52 AM
Subject: [mems-talk] Wafer Bonding Information?

Dear fellow MEMS researchers,

I would like to get an overview of wafer bonding techniques.
I am especially interested to know which materials can be bonded
together by which bonding techniques and what advantages and dis-
advantages there are. Also, which equipment manufacturers there
are. I would be grateful if somebody can point me to good sources
of information or literature.

Thanks and have a nice day,
        Frank Berauer
        Senior R&D Engineer
        Hewlett-Packard Singapore
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