Hi Bob,
I am using PhotoResist as the mask during etching. And the thickness I
want is about 1.5 micron. Actually, I want etch both the photoresist and
the SiO2 at the same etching rate, so that I can transfer the gray scale
structure of my photoresist to SiO2. I have tried using CF4+O2, but my
glass sample was really tough to be get rid of. I am thinking one of the
possible reason is that the glass sample I used, which is actrually used
as microscope cover... Maybe I have to buy some silica wafer to do this
work.


Peng Yao
DOEs lab
Electrical Engineering Dept.
Univeristy of delaware
Newark D.E 19716