Dear Frank,
For the best review on waferbonding (in my opinion) please refer to:
'Wafer direct bonding: tailoring adhesion between brittle materials',
Andreas Ploessl and Gertrud Krauter, Materials Science and Engineering, R25
(1999) pp 1-88.

Orjan Vallin

>Message: 8
>From: "BERAUER,FRANK (HP-Singapore,ex7)" 
>To: "'[email protected]'" 
>Date: Thu, 7 Mar 2002 17:52:37 +0800
>Subject: [mems-talk] Wafer Bonding Information?
>Reply-To: [email protected]
>
>Dear fellow MEMS researchers,
>
>I would like to get an overview of wafer bonding techniques.
>I am especially interested to know which materials can be bonded
>together by which bonding techniques and what advantages and dis-
>advantages there are. Also, which equipment manufacturers there
>are. I would be grateful if somebody can point me to good sources
>of information or literature.
>
>Thanks and have a nice day,
>       Frank Berauer
>       Senior R&D Engineer
>       Hewlett-Packard Singapore


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Orjan Vallin                                           Tel: +46-18-4717254
Uppsala University                                     Fax: +46-18-555095
The Angstrom Laboratory
Solid State Electronics
P.O.Box 534, S-751 21 UPPSALA, Sweden
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