Dear MEMS-talk members,

I am looking for a suitable adhesion layer between an LPCVD SiN
substrate layer and a 0.5 micron thick platinum layer (used as bond
pads) that is stable up to 600 deg. C.
Ideally, we would use the Pt without any adhesion layer, but I fear that
long-term stability/reliability could be an issue then. We apply
sputtering of the Pt and do have tantalum, titanium, TiN and Cr targets
in use with our sputtering machine.
Can anyone propose a suitable solution or even process?

Many thanks in advance.

Joern Koblitz
microFAB Bremen GmbH