Dear Jiang
The HF disolves the Cr.

shay

Jiang Zhe wrote:

> I have a 300A Cr/2500A Au delamination problem. Cr/Au
>
> was deposited on p-type Si <100> wafer. Then it was
> put
>
> into concentrated HF and Cr/Au layer were peeled off
>
> after 30 minutes. The pre-clean (RCA clean and a 2min
>
> Ar plasma pre-etch) was well done before sputtering.
>
> My question is, what's the possible reason of the
>
> delamination? Any suggestion? Thanks!
>
> Jiang
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