You may have a leak in your sputtering system. If so, there may be a
slight oxidation of the chromium. Chromium oxides dissolve in HF...

Michael Pedersen
The MEMS Exchange

On Tue, Apr 09, 2002 at 08:39:45AM -0700, Jiang Zhe wrote:
> I have a 300A Cr/2500A Au delamination problem. Cr/Au
>
> was deposited on p-type Si <100> wafer. Then it was
> put
>
> into concentrated HF and Cr/Au layer were peeled off
>
> after 30 minutes. The pre-clean (RCA clean and a 2min
>
> Ar plasma pre-etch) was well done before sputtering.
>
> My question is, what's the possible reason of the
>
> delamination? Any suggestion? Thanks!