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News	MEMSnet Home: MEMS-Talk: Cr/Au delamination Cr/Au delamination 2002-04-09 Jiang Zhe 2002-04-09 shay kaplan 2002-04-09 Jiang Zhe 2002-04-09 Mike Pedersen 2002-04-09 adnan merhaba 2002-04-09 Atzmon Ofri 2002-04-09 [email protected] 2002-04-09 Maurice Norcott 2002-04-09 Henry Yang 2002-04-10 Henry Yang Cr/Au delamination Maurice Norcott 2002-04-09 30 min 49% HF is enough to undercut the Cr/Au -----Original Message----- From: Jiang Zhe [mailto:[email protected]] Sent: Tuesday, April 09, 2002 8:40 AM To: [email protected] Subject: [mems-talk] Cr/Au delamination I have a 300A Cr/2500A Au delamination problem. Cr/Au was deposited on p-type Si <100> wafer. Then it was put into concentrated HF and Cr/Au layer were peeled off after 30 minutes. The pre-clean (RCA clean and a 2min Ar plasma pre-etch) was well done before sputtering. My question is, what's the possible reason of the delamination? Any suggestion? Thanks! Jiang Yahoo! Tax Center - online filing with TurboTax http://taxes.yahoo.com/ _______________________________________________ [email protected] mailing list: to unsubscribe or change your list options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk Hosted by the MEMS Exchange, providers of MEMS processing services. Visit us at http://www.mems-exchange.org/ reply
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