Hi, Bill:
I am trying to do two processes. First is to bond PDMS with silicon
wafer. Is there any recipe I can follow?
The second is to bond photoresist with PDMS or silicon nitride. But
the photoresist is not fresh, it's developed one. I tried to bond PR with
silicon by heating up to 150 degreeC after developing, but failed. Any
suggestions?
By the way, do you have any idea about PDMS dilution so that it can
be made thiner followed by spin coating?
Thanks.
Bo >From: "Bill Moffat" >Reply-To: [email protected] >To: >Subject:
RE: [mems-talk] Bonding problem! >Date: Wed, 10 Apr 2002 08:26:45 -0700 >
>Bo, > need a clearer picture of what you are doing or trying to do. If
you can >explain more I may be able to help. Bill Moffat > >-----Original
Message----- >From: Bo He [mailto:[email protected]] >Sent: Tuesday,
April 09, 2002 9:37 PM >To: [email protected] >Subject: [mems-talk]
Bonding problem! > > >Hi,everyone: > > I am trying to bond PDMS with
silicon. I followed the recipe in some >references: cleaning both
surfaces with aceton, alcolhol and N2 dry then >using oxygen plasma to
treat both surfaces for 1 min. But results are >bad, they cannot be
bonded together. Any other recipes I can follow or >some important steps
missed in my operation? Please give me some >suggestions. > > Another
question is that if developed photoresist can be bonded with >other
material by heating up to higher temp (150degreeC)? > >Any info is highly
appreciated. Thanks. > >Bo >
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