Dear colleagues:

I have a problem with {100}silicon wafer anisotropic wet etching by KOH to
form V-groove. that is the crossline between {111} orientation surface and
{100} wafer surface curved, such as dent line here and there, which make the
{111} surface have high roughness and not plane. In the experience,using thermal
 oxidate silicon as mask,RIE to make mask figure.can you give me some
information
how to eliminate this curve phenomenon.
Thanks ahead and best regards.

Lib
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