I am looking towards designing some MEMS devices (esp. torsional
Micro-mirrors) using Hybrid flip chip technology. My concern is that I am
still thinking about wheather I should use silicion on glass (Pyrex) or
SI-to-SI bonding. Could you, please, help with advices such that the
drawbacks and the advantages of every assembly, and how they could affect
the properties of the components and their integration density ?

Thank you everyone,

Sofiane Zairi



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