A method of soft baking to produce less bubbles is to use a vacuum oven and
gradually increase the temperature of soft bake and gradually apply vacuum.
The vacuum pulls the solvent out as the soft bake helps liberate the solvent.
The final resist is solvent free and gives a good bubble free base.  Bill

-----Original Message-----
From: Danny Hirdes [mailto:[email protected]]
Sent: Thursday, May 16, 2002 1:26 PM
To: [email protected]
Subject: Re: [mems-talk] Help on thick photoresist


Yes, thick AZ often produces bubbles.

I experienced that AZ 9260 produces much less bubbles than the other AZ
Photoresists I use.

Also ramping up the baking temperature real slow helps a lot to avoid
bubbles.


Good Luck

Danny

----- Original Message -----
From: hongyuyu 
Date: Wed, 15 May 2002 13:06:50 -0700 (PDT)
To: 
Subject: [mems-talk] Help on thick photoresist


> Hi, friends
>
> In bulk microfabrication, I tried to fill a deep channel, which is around
> 200um. When I use AZ5214, there are lots of air bubbles coming out when I
> bake it. So how can I solve this problem?
> Do I need to use different PR? High thick PR?
> I want to try SU-8, but my friends told me that is a dirty material and
> not easy to remove after baking.
> Thanks a lot
> Hongyu
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>

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