Hi everyone,

I am looking for some informations concerning Flip Chip assembly of two wafers
Si to Si or as a second alternative of Si to Glass. Does someone has some ideas,
wibe addresses or references about the placements rules of the spacers (Solder
or Glue) to bond the two wafers and about the related specifications such that
the area of the spacer, and the required spacer/wafers in between materials (if
any) to perform the bonding.

Thank you everyone

Sofiane



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