Hello all,
         Iam a Graduate student looking for Process providers. I need to
deposit a Silicon Nitride layer of thickness 0.3-0.6 microns. I need residual
stress in the film to be TENSILE ( ranging 60-90 MPa). The Silicon nitride can
be either PECVD or LPCVD.

If anyone has some information, please mail me.

Javeed Shaikh Mohammed,
BIOMINDS LAB,IFM,
Louisiana Tech University.
Phone: (318) 257-5127
FAX:   (318) 257-5104
MAIL: PO Box 10307,911 Hergot Ave.
      Ruston, LA  71272

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