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smalek@samcointl.com
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Olgica Bakajin mems-talk@memsnet.org
Thu, 09 May 2002 10:40:19 -0700

What do you use to remove the teflon-like polymer (one of the most inert
things there are!) that gets stuck on the wafer during some RIE processes
(like the passivation layer in DRIE)? I have tried 3:1 sulphuric:peroxide
and oxygen plasma but that still doesn't seem to fully take care of it --
some polymer still stays stuck in the deep narrow trenches. I need
something that would attack the flourocarbons but not damage the silicon.
Any ideas would be appreciated.
--Olgica
Lawrence Livermore National Lab