A MEMS Clearinghouse® and information portal
for the MEMS and Nanotechnology community
RegisterSign-In
MEMSnet Home About Us What is MEMS? Beginner's Guide Discussion Groups Advertise Here
News
MEMSnet Home: MEMS-Talk: HF and photoresist mask
HF and photoresist mask
2002-05-30
Jing Liu
2002-05-30
Mighty Platypus
2002-05-30
Bill Moffat
2002-05-30
Henry Yang
2002-05-30
[email protected]
2002-06-03
Soojin Oh
2002-05-31
Jing Liu
2002-05-31
Mighty Platypus
metal-glass bonding and debonding
2002-06-03
carlton watson
2002-05-31
Greg Miller
2002-05-31
Bill Moffat
2002-05-31
Bill Moffat
2002-05-31
Bill Moffat
2002-05-31
Jing Liu
2002-05-31
Roger Shile
HF and photoresist mask
Mighty Platypus
2002-05-31
I did hardbake the PR. It was AZ 5214, applied to a piranha-cleaned, HMDS
vapor-coated, borofloat glass wafer. It peeled off in less than a
minute. With thermal oxide, maybe your adhesion will be a *little*
better. I abandoned this process pretty quickly, so Bill Moffat's post is
probably more pertinent.

Jesse Fowler

On Fri, 31 May 2002, Jing Liu wrote:

> Jesse,
>
> Did you do hardbake after litho? How did you clean the oxide suface?
>
> Jing
> _______________________________________________
> [email protected] mailing list: to unsubscribe or change your list
> options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk
> Hosted by the MEMS Exchange, providers of MEMS processing services.
> Visit us at http://www.mems-exchange.org/

reply
Events
Glossary
Materials
Links
MEMS-talk
Terms of Use | Contact Us | Search
MEMS Exchange
MEMS Industry Group
Coventor
Harrick Plasma
Tanner EDA
University Wafer
MEMS Technology Review
Tanner EDA by Mentor Graphics
Addison Engineering