Inna,
     Second hand input from the field is with deep UV the amount of light is
far less than the more normal frequencies.  Also the depth of focus is  less.
This leads to either a move to thinner resist or to Silylation to produce a
silicon rich mask in the resist.  With Silylation you can produce a silicon
rich area where you expose and this helps to create an SiO2 layer in Oxygen
plasma.  with this you can get plasma development with Oxygen RIE provided the
plasma pressure is very low.  I like to think of it as the equivalent of a
resist M@M with a crisp outer shell of Si and SiO2.  Hope this helps.  Bill
Moffat

-----Original Message-----
From: Inna [mailto:[email protected]]
Sent: Wednesday, May 29, 2002 12:37 PM
To: [email protected]
Subject: [mems-talk] Deep UV resists


Dear MEMS-talk community members,

I'm looking for some general information on deep UV resists. For instance,
what are the most popular deep UV resists used on the market? Who are the
manufacturers? Is there something special about deep UV resists processing
(special equipment different from what us used for processing of i- and
g-line resists)?

Thank you very much in advance,

Inna Mushkatinskaya

Sr. Process Specialist
Anvik Corporation
6 Skyline Drive
Hawthorne NY 10532

Tel: 914-345-2442, etx.18
Fax: 914-345-2452

Web: www.anvik.com
E-mail: [email protected]
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