I have used the Microchem XP-adhesion/release layer.  It might have a new
name since it came out of the experimental phase.  I have only used it a
few times so far but it works well.  I noticed no difference with the
adhesion (The SU-8 has not lifted up in the few PDMS molds I have made) and
when I removed it, the 50 micron features started to lift off after a
minute in PRS, and the wafer was clean in an hour of hot soaking.
Glen

At 12:01 PM 6/4/2002, you wrote:
>Hi all,
>
>I keep seeing posts on this discussion about what a
>pain it is to remove SU-8, and I couldn't be more in
>agreement.  However, I was recently ordering some SU-8
>and the saleperson at Microchem told me about a spin
>on product called omnicoat which is applied to your
>wafer under the SU-8 layer.  This layer is supposed to
>be attacked by 1165 PR remover and "lift off" the
>SU-8.
>
>Does anyone have experiance using this material? Does
>it work well, and how does it affect SU-8 adhesion
>before removing the SU-8?
>
>Regards,
>
>Jeff