Bill

What are the compounds of HMDS that you deposited (which could be used on
aluminium metallization) "which remained hydrophobic for ever, removeable
with a simple eraser but difficult to clean" from your equipment ? Any
information will be highly appreciated.

regards

m.farooqui

> A possible answer.  IBM developed a process incorporating plasma and HMDS
> in the same system to deposit various compounds of HMDS.  It was a thick
> think many microns of sticky goop that was totally Hydrophobic.  The
> concept was for protection of Hybrid circuits in a submarine.  The part
> had to protected for ever against moisture but the material had to be
> easily removable.  I ran some experiments at that time combining one our
> plasma systems with a HMDS delivery system.  The thick goop was totally
> Hydrophobic, removable with a simple eraser, but if undisturbed remained
> hydrophobic for ever.  Down side the equipment I was using had the goop
> deposited every where and was difficult to clean.  Let me Know if I can
> help to find original IBM patents etc.  Bill Moffat
>
> -----Original Message-----
> From: Robert Dean [mailto:[email protected]]
> Sent: Wednesday, June 05, 2002 8:11 AM
> To: [email protected]
> Subject: [mems-talk] SiN passivation problem
>
>
> >Hello,
>
> I have a MEMS sensor that has aluminum traces covered with 0.4um of
> silicon-nitride, for passivation, that must operate in a moist-salty
> environment.  The part has failed, and I suspect that the moist-salty air
> has permeated through the SiN layer and damaged the aluminum traces
> underneath.  Any suggestions?
>
>
> Robert Dean
>
> Research Associate IV
> Center for Advanced Vehicle Electronics
> Auburn University
> 200 Broun Hall
> Auburn, AL 36849
>
> Voice: 334-844-1838
> Fax:   334-844-1898
> Email: [email protected]
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