Hello,

I recently began working with LiNbO3 substrates and I was wondering if there are
any recommendations for the following problems:

1. charge build-up following baking of resists even though substrate is being
cooled slowly down to 60C.

2. Is there a well known method to increase throughput through the oven bake
steps?

3. After develop, my pattern lifted in the Di water rinse. does anyone have any
suggestions as to the problem of resist adhesion to the substrate (HMDS was used
between the resist and the substrate).

4. Do you have any recommendations for processing information related to LiNbO3
for someone starting the learning curve with this material?

Thanks in advance for all help that you can offer.

Kindest regards,

Nancy.
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