Martin,

Ionized PVD (under several other "trademark" names) is now an industry

standard for Ti/TiN  or Ta/TaN barrier and Cu seed layer deposition
in state-of-the-art semiconductor applications. Al IPVD never really
took off. The equipment is high performance and VERY high price.

Sputtered Al may do the job for you, you can expect about 200%
reflectivity vs. silicon at 436 nm. Relatively inexpensive
modifications to standard sputtering equipment (collimation or
long throw) will significantly enhance bottom coverage of
your features, at the expense of sidewall coverage.


                        (TEEL)          Tokyo Electron Europe Limited
                                        PVD Process Support  (ex MRC)
Klaus Beschorner                                   Tel +49-7033-45683
Drosselweg 6                                       Fax +49-7033-45631
71120 Grafenau, Germany                       Mobile +49-174 315 7754


> Martin,
>
> Try contacting Professor John Booske at the University of Wisconsin at
> Madison:
>
> http://www.engr.wisc.edu/ece/faculty/booske_john.html
>
> He is affiliated with UW's Center for Plasma Aided Manufacturing:
>
> http://cpam.engr.wisc.edu/
>
>
> I spoke with him last several years ago, but at that time he was researching
> a plasma deposition process he called Ionized Metal Vapor Deposition.
> Basically it involved applying a bias voltage to a metal substrate (to be
> coated), generating a plasma, and then sputtering a coating metal which was
> vaporized and attracted to the substrate.  As I recall he could coat just
> about any metal layer onto any metal substrate with excellent conformal
> coating characteristics, even into very deep, high aspect ratio holes.  He
> showed me an object with lots of intricate machining, including tapped screw
> holes, which had been uniformly coated with another metal using this
> process.
>
> I don't know if he is still involved in this project or not, but he should
> be a good contact on the subject.  Good luck.
>
> Regards,
>
> marc
> --
> Marc Straub
> Staff Engineer, Product Development Services
> Coventor, Inc.  (Formerly Microcosm Technologies)
> 7 Corporate Park, Suite 260
> Irvine, CA  92606
> Ph: 949-756-0033  Fax: 949-756-0070
> [email protected]  [take out the XXXX]
>
>
>
>>Message: 1
>>To: [email protected]
>>From: "Martin De_Kegelaer" 
>>Date: Wed, 12 Jun 2002 16:50:01 +0200
>>Subject: [mems-talk] reflective coating
>>Reply-To: [email protected]
>>
>>Dear Mems specialists,
>>
>>I am searching for a way to deposit a high reflective coating inside small
>>holes in PC.
>>These holes are about 10um radius and 100um deep.
>>Any suggestions about the technology to use?
>>Could Al sputtering give a good coverage and what is the reflection% could
>>we expect?
>>
>>Any help is highly appreciated.
>>
>>Thanks,
>>
>>Martin De Kegelaer
>>
>>***************************************************************
>>Martin De Kegelaer
>>Agfa-Gevaert N.V.
>>Research Center on Electronic Imaging
>>Septestraat 27,
>>2640 Mortsel
>>Belgium
>>tel: +32 3444 6243
>>fax: +32 3444 6450
>>***************************************************************