Hello everybody,
I want to use thick positive photoresist to obatain
thickness above 60 microns. I used Az 100 XT for my
research work.But with this resist i could not develop
my patterns. i used AZ 400K (1:3) developer and i
tried at different exposure time. Also i am using film
mask. Even after sufficient soft bake for about 12 min
at 100 degree C, the film mask was sticking to the PR
coated wafer during alignment and exposure.Can anybody
help me to solve above problems? If you  have tried
this photoresist before,let me know the actual recipe
for its patterning.

Thanks!

Keyur Shah
Yahoo! - Official partner of 2002 FIFA World Cup
http://fifaworldcup.yahoo.com