We  used SU8-50 before with a thickness of 50um under
a UV filter. The result showed very little cracking
and T-topping was cured as well. we ramped to 95C and
stay there for 10 mins and annealed in convection oven
for both softbaking and PEB. Developing is carried out
like anywhere. A thinner thickness is even less
possible to make cracks.

Tinghui

--- Mona Klein 
????> Hi all,
>
> we use SU-8 2010 formula supplied by microchem
> Berlin.
> Our usual thickness is 15um, exposure time is 19s
> (broad band UV,
> 10mW/cm^2)
>
> We can't get rid of surface cracks.
> We tried longer relaxation times, baking in a
> convection oven, different
> exposure times, but none of these led to
> significantly improved results.
>
> Has anyone some experience if using a UV filter does
> not also prevent
> T-topping, but also reduce cracking?
>
> Thanks a lot,
>     Mona
> _______________________________________________
> [email protected] mailing list: to unsubscribe
> or change your list
> options, visit
>
http://mail.mems-exchange.org/mailman/listinfo/mems-talk
> Hosted by the MEMS Exchange, providers of MEMS
> processing services.
> Visit us at http://www.memsnet.org/
2002DjJ@=g1-H:P[wiU= QE;"VP9z>[=9HU:+
http://cn.fifaworldcup.yahoo.com/