Hi,  I have a problem with removing fluorocarbon reside off a deep silicon
trench sidewall after a DRIE process (SF6, C4F8 gases used).  Lot of papers
suggest that the polymer can be removed by O2 plasma, but it seems like the
polymer on my wafer get hardened by oxygen plasma.

If you know why sidewall polymer can harden(?) or know how to remove a such
tough polymer, please email to me at [email protected]

Thank you

Ken

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