Hi Derek,
An obvious solution for surface micromachined devices, used e.g. in
TI's DLD micromirror device, is to do sacrificail release of sensitive
structures AFTER dicing, die attach, etc. But then of course you'd
have to handle individual die.
Another option would be MEMS wafer-level packaging (WLP or WSP), an
interesting emerging field with not much work done yet but big future
potential.
I think the "industry standard" for your kind of problem is careful
handling and special fixtures right now.
Greetings,
Frank Berauer
Senior R&D Engineer
Hewlett-Packard Singapore
-----Original Message-----
From: Derek Strembicke [mailto:[email protected]]
Sent: Thursday, July 04, 2002 2:48 AM
To: [email protected]
Subject: [mems-talk] Protecting MEMS devices after etching
Hi all,
What methods do people use for protecting MEMS structures after etching
and before dicing. I am aware of wafer capping (but this is expensive).
At present I handle individual die (R&D level) for etching and
immediately package the devices. Future production quantities mean that
this method not desireable. Obviously there is a wide disparity in the
type of devices that are being handled but I am specifically interested
in mechanical structures (surface or bulk MEMS). One thought is to
deposit a layer (epoxy, PR, or other) with low-viscosity and no
shrinkage during cure. This would fill the cavities and allow for wafer
sawing without breaking devices (theoretically). The material would have
to be easily removed through either a gas phase etchant or liquid soln
(with little to no energy...no ultrasonic or high temp). It is
desireable to handle these as a wafer...for obvious reasons.
Any thoughts or insights
Derek Strembicke
Principal MEMS/VLSI Design Engineer
Stremco Research
P.O. Box 2185
Huntsville, Al, 35804-2185
ph: (256) 653-3423
email: [email protected]
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