Could be the relatively high mass of the Au ions (assuming you are
sputtering). Seems like you would get the reverse effect for
evaporation. That is Au would produce sharper shadows than Cu.

-Mike

>>> [email protected] 07/16/02 06:54AM >>>
We use liftoff process for our chip patterning. The metallization metal
is
either gold or copper. We use same lithography process for both gold
patterning and copper patterning. However, I notice that copper always
shows
a very clean gap after liftoff while gold always have residue on the
edge of
the gap. Can somebody explain why? Your help is very appreciated!

Jessie Zhang
Sr. Thin Film Engineer
Paratek Microwave, Inc.
[email protected]
443-259-0140x153 (O)
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