Jzhang,
       Can you tell me more details about your process.  We market an image
reversal unit that makes lift off easy.  One example that I could send you
pictures of is Hughes who ran a process with 4.8 micron gold finger and 0.8
micron gaps, numerous interdigitated fingers.  Before lift off they had a
large bridging problem after lift of using our reversal process they had no
problems.  Let me know if you wish to get technical papers and or do tests.
Bill Moffat

-----Original Message-----
From: [email protected] [mailto:[email protected]]
Sent: Tuesday, July 16, 2002 6:54 AM
To: [email protected]
Subject: [mems-talk] questions for metallization liftoff


We use liftoff process for our chip patterning. The metallization metal is
either gold or copper. We use same lithography process for both gold
patterning and copper patterning. However, I notice that copper always shows
a very clean gap after liftoff while gold always have residue on the edge of
the gap. Can somebody explain why? Your help is very appreciated!

Jessie Zhang
Sr. Thin Film Engineer
Paratek Microwave, Inc.
[email protected]
443-259-0140x153 (O)
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