AJ,
1. Contact the vendor for specific information on the resist.
2. Spin speed, based on a response surface analysis of speed versus time you
should use something around 1100 rpm for 30 seconds to get 15um thickness.
3. We typically use 115C to 125C, hot plate, with a proximity and contact
bake, about 5-15 minutes depending on the cycle.  If you don't have hot plate
try 125C oven for about 30 minutes.
4. Exposure is about 30-40 mj/cm2 per micron of resist based upon the
intensity measured using a broad bandpass probe.
5. Developer is typically AZ400 K mixed 1 to 3 with DI Water, develop time is
100 to 150 percent beyond the time that you first see the wafer surface
cleaned out in large areas.

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Dear All,

I am using the AZ 9260 photo resist. Just want to get some advice on what
sort of speed should I use to coat 15 um thickness of resist on to wafer.
And where can I get those information on the pre-baking time, the exposure
time and development time.

Very much thanks for any advice indeed...


AJ Pang
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Clif

Clifford J. Hamel
Suss Microtec Applications Engineer
(802) 244-5181, ext 297