Hi Clif,

It is about the baking. If let say I have make a mistake by baking it
at 80C for 2min and have let it cool down for over night. Can I re-
bake it again the next day?

cheers,

AJ Pang



On Thu, 18 Jul 2002 08:32:30 -0400, CLIF HAMEL 
wrote:

> AJ,
> 1. Contact the vendor for specific information on the resist.
> 2. Spin speed, based on a response surface analysis of speed
> versus time you should use something around 1100 rpm for 30
> seconds to get 15um thickness.
> 3. We typically use 115C to 125C, hot plate, with a proximity
> and contact bake, about 5-15 minutes depending on the cycle.
> If you don't have hot plate try 125C oven for about 30
> minutes.
> 4. Exposure is about 30-40 mj/cm2 per micron of resist based
> upon the intensity measured using a broad bandpass probe.
> 5. Developer is typically AZ400 K mixed 1 to 3 with DI Water,
> develop time is 100 to 150 percent beyond the time that you
> first see the wafer surface cleaned out in large areas.
>
> ====================================================================
> Dear All,
>
> I am using the AZ 9260 photo resist. Just want to get some
> advice on what
> sort of speed should I use to coat 15 um thickness of resist
> on to wafer.
> And where can I get those information on the pre-baking time,
> the exposure
> time and development time.
>
> Very much thanks for any advice indeed...
>
>
> AJ Pang
> _______________________________________________
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>
> Clif
>
> Clifford J. Hamel
> Suss Microtec Applications Engineer
> (802) 244-5181, ext 297
>
>
>

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