Hi all,

I was wondering if anyone could give me any help from their
experience or direction to literature on the following problem. I don't
know if this will seem trival to some but I have been able to find
little technical information on the subject.

I need to deposit a layer (200-300nm thick but this is not critical) of
metal (electrical properties not important) on a polymer substrate.
This needs to be done at a temperature of less than 50 deg celcius
with the lowest possible surface rougness (sputtering is
unfortunatley not an option!). From what I can gather, electroless
plating of copper (nickel requires temperatures of 80-90 deg C?)
using a tin chloride pre-catalyst, a palladium catalyst and copper
salt + formaldehyde plating solution could be an option.

Any advice, recipies or recommended reading material on this
matter would be greatly appreciated.

Thanks in advance and best regards,

Novak