Hi MEMS-people,
I'm looking for an ICP processing service for 4 inch (500 um thick)
Si wafers, etching depth from 50 to 400 um, minimum feature size
about 50 um, amount of wafers: 5-10. Fast processing time appreciated.
Please contact me as soon as possible.
Regards,
--
-----------------------------------------------------------------------------
-
Joachim Oberhammer, Dipl.-Ing.
Royal Institute of Technology (KTH) Phone: +46/(0)8 790 6250
Dep. of Signals, Sensors and Systems Fax: +46/(0)8 10 0858
Microsystem Technology (MST) Mobile: +46/(0)70 692 1858
e-mail: [email protected]
Osquldas vdg 10 homepage: http://www.s3.kth.se/mst/
SE-100 44 Stockholm, Sweden
